EVG and CEA/Leti - Press Release

EV Group (EVG) announced it has entered a joint development program (JDP) with CEA/Leti.  EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary bonding and debonding technology.  The first system will be shipped in May.  The joint development work will focus on further developing these technologies and processes to accelerate continued adoption of TSV technology-given its demonstrated advantages, which include higher performance, increased functionality, smaller footprint and lower power consumption.

Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power.  In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications.  This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale.

More information at www.evgroup.com