CMP/CMC/MOSIS - Press Release

CMP/CMC/MOSIS are partnering to offer a 3D-IC MPW service based on Tezzaron’s SuperContact technology and GLOBALFOUNDRIES 130nm CMOS.

The first MPW run is targeting January 2011:
- 2-tier face-to-face bonded wafers
- 130nm CMOS process for both tiers
- Top tier exposing TSV and backside metal pads for wire bonding.

A design-kit supporting 3D-IC design with standard-cells and IO libraries is available.

Further MPW runs will be scheduled supporting process flavors (multiple tiers beyond 2, different CMOS flavors for different tiers, ...) driven by user requirements.

More information at http://cmp.imag.fr