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PRODID:-//AT Content Types//AT Event//EN
VERSION:2.0
METHOD:PUBLISH
BEGIN:VEVENT
DTSTAMP:20100907T132921Z
CREATED:20090903T091738Z
UID:ATEvent-bd9a6833a7adeab74c5d24c306c35402
LAST-MODIFIED:20090903T114413Z
SUMMARY:Wafer Bonding - WaferBond ‘09
DTSTART:20091205T230000Z
DTEND:20091207T230000Z
DESCRIPTION:The International Conference on Wafer Bonding - WaferBond 
 ‘09  will be held at the “Maison des Micro et Nanotechnologies” 
 - MINATEC® December 6th to 8th 2009 in Grenoble / France.
LOCATION:Grenoble / France.
CONTACT:Roy Knechtel\, roy.knechtel@xfab.com
URL:http://www.microtesting.de
CLASS:PUBLIC
END:VEVENT
END:VCALENDAR