Wafer Bonding - WaferBond ‘09
The International Conference on Wafer Bonding - WaferBond ‘09 will be held at the “Maison des Micro et Nanotechnologies” - MINATEC® December 6th to 8th 2009 in Grenoble / France.
| What |
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|---|---|
| When |
Dec 06, 2009 12:00 AM
to
Dec 08, 2009 12:00 AM |
| Where | Grenoble / France. |
| Contact Name | Roy Knechtel |
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The conference will cover the following topics:
- direct, anodic, thermo-compression (glass, polymer, metal) wafer bonding techniques for MEMS fabrication,
- 3D integration (wafer-wafer and chip-wafer) using wafer bonding techniques,
- industrial applications of wafer-bonded MEMS (e.g. automotive, medical and optical applications),
- interaction of wafer-bonded MEMS with subsequent fabrication steps (wire bonding, soldering, molding),
- characterization and reliability of wafer-bonded MEMS (yield, quality, strength, fatigue, hermeticity),
- wafer bonding of non-semiconductor materials (polymers or ceramics),
- markets, trends, standardization, wafer bonding equipment and ceramics
Abstracts (about 200 words) should be submitted by August 14th 2009 to roy.knechtel@xfab.com. The use of the abstract template is required. Authors will be informed of acceptance by September 10, 2009. Extended abstracts (up to 4 pages) are due November 5th 2009. Please, visit www.microtesting.de for more information
