BEGIN:VCALENDAR
PRODID:-//AT Content Types//AT Event//EN
VERSION:1.0
BEGIN:VEVENT
DTSTART:20101011T070000Z
DTEND:20101014T160000Z
DCREATED:20100129T142834Z
UID:ATEvent-113bdffde745af5807fed04de4d4c91e
SEQUENCE:0
LAST-MODIFIED:20100129T142842Z
SUMMARY:IWLPC - International Wafer-Level Packaging Conference
DESCRIPTION:The conference includes three tracks with two days of pape
 rs covering\: Wafer Level Packaging\; 3-D (Stacked) Packaging\; and ME
 MS Packaging.
LOCATION:Santa Clara\, CA\, USA
PRIORITY:3
TRANSP:0
END:VEVENT
END:VCALENDAR