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ESTC 2010

Third Electronics System Integration Technology Conference

What
When Sep 13, 2010 09:00 AM to
Sep 16, 2010 06:00 PM
Where Berlin, Germany
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The success of the first ESTC Conferences in Dresden (2006) and Greenwich (2008) has established the Electronics System Integration Technology Conference as the premier European event in the realm of microelectronic packaging. Organized by IEEE-CPMT the ESTC conference is the ideal place to meet with your colleagues to discuss the latest advances in a variety of technologies, which cover the entire system integration supply chain.

Topics:

  • Advanced Packaging
  • Microsystem Packaging
  • New Materials and Processes
  • Optoelectronics
  • Assembly and Manufacturing
  • Modelling and Simulation
  • Applied Reliability
  • Power Electronics
  • Electrical Design and Modelling
  • Emerging Technologies

 

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