Design, Test, Integration & Packaging of MEMS/MOEMS
Invitation to participate
| What |
|
|---|---|
| When |
Apr 25, 2012 09:00 AM
to
Apr 27, 2012 06:00 PM |
| Where | Cannes, France |
| Add event to calendar |
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DTIP 2012 will be a follow-up to the very successful
issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in
Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006,
in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome,
Italy, in 2010 in Seville, Spain and in Aix-en-Provence, France in
2011. This series of Symposia is a unique single-meeting event expressly
planned to bring together participants interested in manufacturing
microstructures and participants interested in design tools to
facilitate the conception of these microstructures. Again, a special
emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of
packaging solutions. The goal of the Symposium is to provide a forum
for in-depth investigations and interdisciplinary discussions involving
design, modeling, testing, micromachining, microfabrication, integration
and packaging of structures, devices, and systems.
We look forward to welcoming you to Cannes, Côte d'Azur, France.
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM
